Preventing FPCB Pad Cracking: Bump Design, Material Selection & Stamping Guide

By |2026-09-01T11:37:49+08:0026 March 2026|Tags: , , |

Direct answer: FPCB pad bump cracking is most effectively prevented by combining three controls: Design— lower bump height, rounded transition profiles, and fillets at pad-to-trace junctions. Material — high-ductility copper foil, [...]