Liquid Metal Flexible Circuits: High-Reliability 3D Printed PI-Based Encapsulation Technology

By |2026-10-22T14:38:40+08:0010 March 2026|Tags: , , |

Liquid Metal Flexible Circuits combine a eutectic gallium-indium conductor with a polyimide (PI) substrate and cover layer. The PI layers fuse during 3D printing, so the wiring stays sealed when it bends, [...]