Rigid-flex circuit technology is chosen when a compact or moving assembly cannot rely on a rigid board alone.
Gekunflex supports rigid-flex circuit technology from prototype to volume production, covering stack-up, coverlay, and assembly notes.
Flexible PCB Material Stack-Up: Types, Functions, and Performance
Guide to Flexible PCB Material Stack-Up: FCCL, substrates, metal foil, adhesive, and cover film, and how each layer affects flexibility and
Laser Solder Ball Bonding for FPCB: Low Heat-Affected Zone Substrate P
Laser solder ball bonding for FPCB uses localized precision heating and low HAZ control to protect PI/PET substrates, cut delamination, and
Dual-Laser Etching and Cleaning for FCCL Blind Vias: Achieving High Pr
How dual-laser etching and cleaning for FCCL blind vias uses UV nanosecond and picosecond lasers to achieve high-precision, high-cleanliness
Improve PCB Micro-Drill Performance on Flex Boards
Learn about Improve PCB Micro-Drill Performance on Flex Boards: key specs, applications, and sourcing tips for B2B buyers. Get a quote from
Research on the Manufacturing Process of Semi-Rigid Flex Printed Circuit Boards
Semi-rigid printed circuit boards form a type of rigid-flex printed circuit board (R-FPCB). The conventional rigid board manufacturing process produces them by milling or cutting out openings (windows) in areas requiring flexibility. They eliminate the need for expensive flexible materials like polyimide (PI), reducing costs while offering more stable electrical performance. These boards commonly serve in static or semi-dynamic[...]
Experimental Study on Crimp Terminals for FPCB Connectors
Crimp terminals connect an FPCB to a connector without soldering or laser welding: the terminal tip pierces the finger’s insulation and wraps the contact, creating electrical continuity through compression. This FPCB crimp terminal study tests how tool height, pressure, and crimping speed change contact resistance, pull-out force, and surface damage on the FPC finger, with the goal of identifying[...]
