PI-Based Flexible Circuits: 3D Printing Encapsulation and Liquid Metal Reliability Optimization (Part II)
Back to Part 1 « Effect of Process Parameters on Line Widths in Circuit and Packaging Layers Process parameters are critical to the line widths in circuit and packaging layers. Therefore, this study [...]
Rigid-Flex PCB Air-Gap Process Optimization for High-Yield Flexible Circuit Manufacturing(Part II)
Back to Part 1 « Evaluation by replacing dry film with a wet film with better flow properties Liquid ink shows good filling and flow properties. It is expected to effectively [...]
Medical Ultrasound FPCB Design: Optimization of 3L Stepped and Cutout Flexible Circuit Structures
Ultrasound probe products are widely used in medical diagnostic equipment. Some probes are designed for single use and are classified as medical consumables, resulting in strong market demand and broad growth [...]
Pattern-Based FPC Routing Algorithm for Optimized Flexible PCB Design(Part I)
Flexible printed circuits (FPCs) are a specialized type of printed circuit board increasingly used in miniaturized and diversified electronic products. As applications expand, FPC designs have become more complex. Unlike conventional [...]
Liquid Metal Flexible Circuits: High-Reliability 3D Printed PI-Based Encapsulation Technology
Soft circuits have been a hot topic in health monitoring, biomedical, and rehabilitation diagnostics research in recent years. Traditional flexible conductors are fabricated by combining conductive fillers with stretchable elastomers. For [...]
High-Frequency Rigid-Flex PCB Manufacturing: Key Process Technologies Using PTFE Materials
With the advancement of information technology, higher demands have been placed on the efficient and stable transmission of electrical signals, driving continuous upgrades in high-frequency materials. Influenced by market needs, the [...]
