About gekun flex

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So far gekun flex has created 87 blog entries.

HDI Rigid-Flex PCB Manufacturing Process and Technical Challenges in Advanced Medical Electronics

By gekun flex|2026-08-06T00:17:15+08:0022 May 2026|Tags: flexible electronics, HDI PCB manufacturing, Rigid-Flex PCB|

Rigid-Flex PCB: Rework Reliability, Storage Conditions, and Failure Analysis

By gekun flex|2026-08-06T00:14:11+08:0018 May 2026|Tags: aerospace electronic assembly, Flexible Printed Circuit Boards, rigid-flex PCB rework|

Optimization of Differential Impedance in FPCB Using Mesh Copper Reference Layer

By gekun flex|2026-08-06T00:14:28+08:0015 May 2026|Tags: CST simulation, FPCB design, Signal Integrity|

Laser Welding FPCB: Effects of Welding Time, Pressure, and Temperature on Joint Quality

By gekun flex|2026-08-06T00:14:45+08:0013 May 2026|Tags: FPCB welding, laser welding, solder joint quality|

PET vs FPC Selection Guide: How to Choose the Right Circuit for Thin-Film Control Panels

By gekun flex|2026-08-06T00:14:58+08:009 May 2026|Tags: control panel circuits, FPC design, PET silver paste|

Multi-Layer FPC Manufacturing Process: Complete Step-by-Step Guide from Cutting to Testing

By gekun flex|2026-08-06T00:15:15+08:006 May 2026|Tags: Flexible Printed Circuit, FPC production, PCB manufacturing|

PI-Based Flexible Circuits: 3D Printing Encapsulation and Liquid Metal Reliability Optimization (Part II)

By gekun flex|2026-04-30T23:33:56+08:001 May 2026|Tags: electrohydrodynamic jet printing, flexible circuits, Process parameters|

Back to Part 1 « Effect of Process Parameters on Line Widths in Circuit and Packaging Layers Process parameters are critical to the line widths in circuit and packaging layers. Therefore, this study [...]

PI-Based Flexible Circuits: 3D Printing Encapsulation and Liquid Metal Reliability Optimization (Part I)

By gekun flex|2026-08-06T00:16:19+08:0029 April 2026|Tags: flexible circuits, liquid metal circuits, PI-based 3D printing encapsulation|

Application and Development Trend of Low Dielectric Loss Materials in Flexible Printed Circuit Boards Field (Part II)

By gekun flex|2026-08-06T00:16:45+08:0025 April 2026|Tags: high-frequency PCB materials, LCP FPC materials, low dielectric materials|

Application and Development Trend of Low Dielectric Loss Materials in Flexible Printed Circuit Boards Field(Part I)

By gekun flex|2026-04-25T15:14:39+08:0023 April 2026|Tags: 6G communication, flexible printed circuit board, low dielectric materials|

6G is expected to become commercially available around 2030 and will deliver a quantum leap in performance. Transmission speeds will increase to 50 times those of 5G, latency will decrease to [...]

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Gekun – Your Trusted Flex PCB Manufacturer
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