Rigid-flex circuit technology is chosen when a compact or moving assembly cannot rely on a rigid board alone.
Gekunflex supports rigid-flex circuit technology from prototype to volume production, covering stack-up, coverlay, and assembly notes.
FPCB Pad Cracking Prevention: Bump Design, Material Selection & Stampi
Learn FPCB pad cracking prevention through bump design rules, copper foil and plating selection, and stamping process optimization to avoid
Rigid-Flex PCB Manufacturing: Process Optimization for Outer-Layer Flexible Structures
Rigid-flex printed circuit boards (R-FPCBs) combine the advantages of both rigid and flexible boards. As printed circuit boards (PCBs) continue to evolve toward being lighter, thinner, and smaller, the demand for these products is growing steadily. While the design of R-FPCBs offers significant convenience, it also presents greater challenges than the manufacturing processes for conventional rigid PCBs (rigid boards).[...]
Pattern-Based FPC Routing Algorithm for Optimized Flexible PCB Design(Part II)
Continued part I... › Cost-Based Allocation of Routing Layers In practice, routing often involves multiple layers. Using only a single layer would result in a severe shortage of routing resources and overlook the fact that via placement is permitted in fan-out regions. Multi-Layer Routing Considerations Considering that routing paths on different layers have varying routing parameters and different impacts[...]
Pattern-Based FPC Routing Algorithm for Optimized Flexible PCB Design(Part I)
Flexible printed circuits (FPCs) are a specialized type of printed circuit board increasingly used in miniaturized and diversified electronic products. As applications expand, FPC designs have become more complex. Unlike conventional PCB routing, FPC routing faces stricter constraints and highly irregular routing spaces. FPC Routing Challenges In FPC layouts, components are densely concentrated within fan-out regions, resulting in uneven[...]
Innovative Flexible Circuit Manufacturing Using UV-Assisted Electroless Plating
The current manufacturing of flexible circuits primarily relies on traditional etching methods, conductive ink printing, and electroless copper plating technologies. While traditional etching is suitable for mass-customized circuit production, it suffers from issues such as pronounced side etching effects, complex process flows, lengthy production cycles, and environmental pollution from acid cleaning. These drawbacks make it difficult to meet the[...]
Liquid Metal Flexible Circuits: High-Reliability 3D Printed PI-Based Encapsulation Technology
Liquid Metal Flexible Circuits combine a eutectic gallium-indium conductor with a polyimide (PI) substrate and cover layer. The PI layers fuse during 3D printing, so the wiring stays sealed when it bends, stretches, or heats up. This article explains the encapsulation process, the printing parameters that control it, the wetting and oxide controls that make it repeatable, and the checks[...]
