Rigid-flex circuit technology is chosen when a compact or moving assembly cannot rely on a rigid board alone.
Gekunflex supports rigid-flex circuit technology from prototype to volume production, covering stack-up, coverlay, and assembly notes.
High-Frequency High-Speed FPC Materials for 6G (Part I)
A high-frequency high-speed FPC is a flexible printed circuit built to carry fast signals with low loss. For 6G, designers pair low-Dk and low-Df dielectrics with microstrip or stripline stack-ups. This guide explains the material choices behind 6G FPC materials and how MPI and LCP for high-speed FPC fit the picture. 6G FPC Materials: Why Dielectric Loss Now Matters[...]
Wet Film + Dry Film Hybrid Process for Rigid-Flex PCB Air-Gap Yield Op
wet film + dry film hybrid process for rigid-flex PC: specs, applications, sourcing tips, quality notes, and manufacturing support for
Rigid-Flex PCB Air-Gap Process Optimization: Lamination, Film and Yield
A study on rigid-flex PCB air-gap process optimization: lamination methods, pretreatment, dry film and pattern transfer to improve flexible
Rolled Copper Foil for FPC: Improving Fold Resistance, Flatness, and Etchability
In recent years, the production of high-qu ality flexible printed circuit boards has placed higher performance demands on its key conductive material— rolled copper foil. This is particularly evident in aspects such as the foil’s fold resistance, high elongation, etchability, and low surface roughness. At the same time, higher demands have been placed on its adaptability to FPC manufacturing[...]
FPC Design: Materials, EDA Tools, and Signal Integrity Guide
However, FPC design is the process of turning a flexible copper-and-polymer laminate into a bendable circuit that survives folding, twisting, and assembly. Therefore, good FPC design guidelines link three decisions: material stack-up, flex PCB EDA tools, and impedance control. Additionally, this guide explains how those choices interact, from bend-area routing to the fabrication drawing. Materials and Stack-Up Come First[...]
Medical Ultrasound FPCB Design: Optimization of 3L Stepped and Cutout Flexible Circuit Structures
A medical ultrasound flexible circuit design often must fit dense probe electronics into very small housings. A 3L stepped structure combined with a cutout flexible circuit layout improves spatial arrangement, reduces component interference, and protects hollow finger areas from cracking. This guide covers the process routes used for an ultrasound FPCB stepped cutout build, the wrinkling defects those routes[...]
FFC vs FPC: Key Differences and How to Choose
Compare FFC vs FPC in structure, performance, EMI shielding, connectors, cost, and applications. Learn how to choose the right flexible
