Rigid-flex circuit technology is chosen when a compact or moving assembly cannot rely on a rigid board alone.
Gekunflex supports rigid-flex circuit technology from prototype to volume production, covering stack-up, coverlay, and assembly notes.
Rigid-Flex PCB Drilling: New Technologies to Reduce Burrs and Improve Yield
Rigid-Flex PCB Drilling creates burrs because the flex zone sits lower than the rigid zone. The drill exits into a gap between the board and the backing plate, so soft material tears instead of cutting cleanly. This guide explains the burr mechanism, places drilling inside the full process flow, compares mechanical and laser drilling, and shows which burr reduction methods[...]
Flexible PCB SMT Process: Complete Guide to Flexible Printed Circuit Assembly and Manufacturing
Flexible PCB is a flexible circuit board, also known as a flexible circuit or bendable circuit board, and commonly referred to as a “flex board.” It is a highly reliable, flexible printed circuit made using polyimide or polyester film as the substrate. The miniaturization of electronic products is an inevitable trend. Due to space constraints during assembly, a significant[...]
Flexible PCB Process Guide
Learn about Flexible PCB Process Guide: key specs, applications, and sourcing tips for B2B buyers. Get a quote from Gekunflex.
Types and Characteristics of Flexible Copper-Clad Laminates
A flexible copper-clad laminate (FCCL) is a base material for flexible printed circuits and rigid-flex boards. It combines a flexible insulating base film with a metal layer. High flexibility is its most prominent feature, so FCCL is also called soft copper-clad laminate. A typical FCCL product is shown in Figure 1. Copper-clad laminates (CCL) used in PCB manufacturing fall[...]
Rigid-Flex Boards Dimensional Stability: Control of Expansion and Cont
Rigid-flex boards need strict dimensional control in mass production to ensure yield, mating accuracy, and long-term reliability across flex
Rigid-Flex PCBs in Robotics: Key Enabling Technology for Humanoid and Industrial Systems
As robotics advances from traditional industrial automation toward humanoid robots, collaborative robots, autonomous mobile platforms, and wearable exoskeletons, electronic architectures are becoming increasingly complex. Modern robots must integrate high-performance computing, multi-sensor perception, real-time communication, precision motion control, and efficient power management within highly constrained spaces. Traditional rigid PCBs connected through cables and connectors often struggle to satisfy these requirements.[...]
FPC Bending Resistance: How to Design FPCs for Good Resistance to Bend
FPC bending resistance guide: static vs dynamic bending, material selection, routing strategy, and mechanical design to improve flex circuit
Enhancing FPC Insulation Performance in Ultra-Long Thick Copper Flexible Circuits
FPC insulation performance describes how well a flexible printed circuit resists electrical breakdown between its conductors and layers. In ultra-long thick copper designs, it depends on dielectric thickness, material choice, and process control. This article covers the failure causes, planning steps, and FPC dielectric withstanding voltage targets that keep these circuits reliable. What FPC Insulation Performance Means in Ultra-Long[...]
PTFE Blind Via Metallization Process for High-Frequency FPC: Black Hol
PTFE blind via metallization process for high-freque: specs, applications, sourcing tips, quality notes, and manufacturing support for
Optimizing Blind Slot Multilayer Flexible PCB Manufacturing: A New Laser-Controlled Fabrication Method
Traditional mechanical milling of blind slots in multilayer flexible PCBs is hard to control. The cutter removes material by force, so it can leave burrs, smear dielectric, compress the bondply, and drift in depth as tool wear and stack tolerance add up. The problem gets worse when the slot floor must keep a thin dielectric layer over live traces.[...]
Flexible Tactile Sensor Design Using FPCB Processing for Robotic and Industrial Applications
A Flexible Tactile Sensor is a thin contact-sensing device that reads pressure, temperature, hardness and surface material at the point of touch. FPCB processing turns this design into a low-cost, short-lead-time part with high yield, which makes it practical for robotic and industrial equipment. This page follows the layered structure used in the tactile-sensing literature — mechanism, high-resolution taxel[...]
High Frequency Flexible PCB Impedance Control: Complete Design & Engin
Learn high frequency flexible PCB impedance control techniques: material selection, stackup planning, trace geometry, and testing to
Design of Automatic Assembly Equipment for Flexible Circuit Board
Learn about Flexible Circuit Board Assembly Equipment Design: key specs, applications, and sourcing tips for B2B buyers. Get a quote from
PCB Surface Finish Types Explained: Best Options for Flexible PCBs
Introduction: Why Surface Finish Matters in PCB Fabrication Every circuit board requires protection for its copper traces. Without a reliable finish, exposed copper quickly oxidizes, reducing electrical conductivity and making soldering nearly impossible. This is why PCB surface finishes are a critical step in PCB fabrication. Surface finishes serve as a protective layer. They create a flat surface for[...]
PCB Lamination Process Explained: From Rigid Boards to Flexible PCB Manufacturing
PCB Lamination is the step that bonds copper foil, prepreg or adhesive, and a core or polyimide base into one solid board under heat and pressure. It determines layer adhesion, thermal endurance, and mechanical strength. In addition, it is the core of both rigid and flexible PCB lamination. For a flex board or a Rigid-Flex PCB, the idea is the[...]
PCB Etching Process: Flexible PCB & Rigid Flex Manufacturing
PCB Etching Process: Flexible PCB & Rigid Flex Manufacturing Introduction The etching task in PCB design is one of the most important steps in making printed circuit boards. It directly influences the precision of the circuit trails, hence performance, as well as the life of the end product. Accurate etching is important. It is used to create a standard[...]
PCB Copper Plating Process for Reliable Conduction
Introduction Copper plating is the step that turns drilled holes into conductive paths. A controlled copper layer is deposited on hole walls and trace surfaces, so every plated through hole carries current and every trace stays intact after bending. In [flexible circuits](https://gekunflex.com/flexible-circuit/), flex PCB copper plating carries an extra burden: it has to hold up under repeated flexing and[...]
Flexible PCB Material Preparation: Cutting and Cleaning Process
Flexible PCB material preparation is the first production step in flex manufacturing. It covers incoming inspection, polyimide base material preparation, cutting to panel size, edge trimming and surface cleaning. Done well, it protects yield in etching, lamination and coverlay alignment. This guide explains the materials, cutting methods, flex PCB cutting cleaning controls and inspection criteria. Flexible PCB Material[...]
HDI Rigid-Flex PCB Manufacturing Process and Technical Challenges in Advanced Medical Electronics
An HDI rigid-flex PCB combines high-density interconnect layers with a flexible circuit, so one board can bend, fold, and carry dense signals. The high-density rigid-flex process bonds rigid and flexible materials, then uses laser via rigid-flex HDI to link fine traces across the rigid and flex zones. As a result, the board suits compact medical electronics where space[...]
Laser Welding FPCB: Effects of Welding Time, Pressure, and Temperature
Learn about laser welding FPCB process parameters: key specs, applications, and sourcing tips for B2B buyers. Get a quote from Gekunflex.
High-Frequency High-Speed FPC Materials for 6G (Part I)
A high-frequency high-speed FPC is a flexible printed circuit built to carry fast signals with low loss. For 6G, designers pair low-Dk and low-Df dielectrics with microstrip or stripline stack-ups. This guide explains the material choices behind 6G FPC materials and how MPI and LCP for high-speed FPC fit the picture. 6G FPC Materials: Why Dielectric Loss Now Matters[...]
Rigid-Flex PCB Air-Gap Process Optimization: Lamination, Film and Yield
A study on rigid-flex PCB air-gap process optimization: lamination methods, pretreatment, dry film and pattern transfer to improve flexible
Rolled Copper Foil for FPC: Improving Fold Resistance, Flatness, and Etchability
In recent years, the production of high-qu ality flexible printed circuit boards has placed higher performance demands on its key conductive material— rolled copper foil. This is particularly evident in aspects such as the foil’s fold resistance, high elongation, etchability, and low surface roughness. At the same time, higher demands have been placed on its adaptability to FPC manufacturing[...]
